Copper Powders
Ultradispersed High-Purity Isotopic Copper Nanopowder (6N / 99.9999% – Oxygen-Free)
Securely sealed under argon in glass ampoules or PET containers for maximum stability.
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Yes, trial orders are available for most products, excluding custom-engineered alloys. Please select the “Trial quantity required” option when submitting your RFQ form.
Yes, every delivery includes a lab certificate to verify product purity and ensure batch-to-batch consistency.
Yes, we assist with all necessary documentation to help streamline logistics, compliance, and customs clearance — regardless of the products combination or technical specifications in your order.
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Ultra High-Purity Copper: Material Profile
Ultrafine high-purity copper powder is a specialized form of transition metal copper, engineered at micro and nanoscale levels to meet the most demanding performance requirements. As a transition element, copper possesses an incomplete d-electron shell, enabling it to exhibit multiple oxidation states — primarily Cu⁺ and Cu²⁺. The metal has a melting point of 1083 °C, a boiling point of 2600 °C, and a vapor pressure of 8.6 × 10⁻⁵ mm Hg at 1000 °C.
What sets ultrafine high-purity copper powder apart is its exceptionally high electrical resistivity (1.68 μΩ·cm) and outstanding thermal conductivity (0.941 cal/cm·°C·s), characteristics that are critical in high-end electronics, photonics, and precision manufacturing. The ultrafine particle structure, combined with a purity level of 5N (99.999%) or higher, makes this material ideal for applications where conductivity, heat transfer, and material integrity must not be compromised.
Performance of ultrafine high-purity copper powder is directly influenced by the presence of impurities. Even minimal traces of elements like oxygen, chromium, vanadium, manganese, titanium, zirconium, or niobium can significantly reduce the material’s conductive efficiency. This is why tight control of composition and oxygen content is essential during production, particularly for use in microelectronics, vacuum devices, energy systems, and other high-tech applications.
Product Form and Handling
Ultrafine high-purity copper powder is supplied as a finely dispersed metallic powder, typically featuring a controlled spherical or dendritic particle morphology and grain size in the micrometer or sub-micrometer range. Engineered for uniform dispersion, high surface area, and predictable sintering behavior, this form factor is ideal for advanced applications such as powder metallurgy, additive manufacturing, microelectronics, and catalysis.
Unlike solid copper forms, ultrafine high-purity copper powder requires careful handling and packaging. Each batch is sealed under inert conditions — typically in glass ampoules, vacuum-tight containers, or protective polymer-based packaging — to eliminate contamination risks and preserve purity during storage and international transit. This ensures the powder remains free from oxidation, moisture uptake, and particulate interference, maintaining its performance-critical characteristics across the entire supply chain.
Applications of Ultra High-Purity Copper (5N–6N)
Ultrafine high-purity copper powder — prized for its outstanding electrical conductivity, thermal efficiency, and chemical stability — plays a foundational role in modern high-performance industries. With a purity of 99.999% (5N) and above, it is engineered for applications where conventional-grade materials are insufficient. Key application areas include:
