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6N Copper Nanopowder2025-06-02T16:42:41+03:00
Ultrafine copper powder

6N Copper Nanopowder

Ultradispersed Ultrafine Copper Powder (5N/99.999% & 6N/99.9999% – Oxygen-Free)

Securely sealed under argon in glass ampoules or PET containers for maximum stability.

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Product Details

  • Metal

    • Copper (Cu)
  • Purity grades

    • ≥ 99.999% (5N)
    • ≥ 99.9999% (6N)
  • Impurities

    • ≤ 0.0001% (Li, Be, Ti, V, Cr, Co, Rb, Mo, Pd, Cd) for 6N
  • Oxygen-free

    • Yes (< 10 ppm (parts per million) )
  • Isotopic composition:

    • Cu-63: 69.09% +/- 0.05%
    • Cu-65: 31.91% +/- 0.05%
  • Radioactivity

    • Non-radioactive
  • Particle size, dispersion, morphology, and other parameters

    • Our ultradispersed copper nanopowders typically features particle sizes below 100 nm (<1 µm), with fractions an order of magnitude finer available upon request.
    • For detailed powder specifications, please request actual properties in your RFQ. Specific parameters will be included in the commercial offer tailored to your requirements and requested product quantity.
  • Supply forms & packaging

    • 250 g glass ampoules, hermetically sealed under argon atmosphere, shipped in protective cases.

    • 2 kg PET containers, sealed under argon atmosphere, shipped in plastic boxes.

  • Product international standards compliance cross-reference

    • High-Purity Copper Powder:
    Purity Grade Standard System (Region) Standard Reference
    6N,
    Oxygen-free
    GOST / TU (CIS) TU 24.44.22-001-75815004-2022
    EN / ISO (Europe) ISO 4954 (5N max.); ISO 4491 (Oxygen content)
    JIS (Japan) JIS H 2123 (4N-5N max.)
    ASTM (USA) ASTM B243 (5N max.)
  • HS code (Customs сlassification for international trade)

    • 7406.10.00 — Copper powders and flakes (refined / high-purity)
  • Dual-use classification

    • Not applicable (not subject to special export/import controls)
  • Available delivery terms (Incoterms 2020)

    • EXW (Ex Works)
    • FCA (Free Carrier)
    • DAP (Delivered at Place)
  • Quotation on request

    • Submit your RFQ to receive our best offer tailored to your specifications and required quantity.

Real FAQs

Can I order a trial quantity?2025-06-01T12:23:18+03:00

Yes, trial orders are available for most products, excluding custom-engineered alloys. Please select the “Trial quantity required” option when submitting your RFQ form.

What is the typical lead time for orders?2025-06-01T12:20:29+03:00

Lead times vary depending on the type of order. Below is an overview of typical processing and delivery times for our main order categories:

  • Trial batch orders are typically dispatched within 5 business days from the date of payment receipt.
  • Ultra high-purity metals purchase orders are fulfilled within 7–14 business days from the date of advance payment under the main agreement, depending on quantity and destination.
  • Custom alloy wire manufacturing orders include a development phase and are scheduled individually based on product complexity, specification, and volume.

Lead time for each custom alloy wire contract is determined jointly with the client and includes both production and quality assurance stages.

Can you deliver to the buyer’s destination?2025-06-01T12:21:10+03:00

Yes, we can arrange logistics and deliver to any international airport specified by the buyer.

What is your order processing workflow?2025-06-02T18:08:02+03:00

Our order processing follows a structured and transparent workflow aligned with Incoterms 2020 practices:

  1. Client: submits an LOI (Letter of Intent) or RFQ form to Pure Metals.
  2. Jointly: we clarify and confirm all technical and commercial details of the LOI/RFQ.
  3. Pure Metals: issues an FCO (Full Corporate Offer). We intentionally skip SCO (Soft Corporate Offer) to streamline the process.
  4. Client: confirms the FCO and provides proof of funds (BCL or equivalent banking document).
  5. Optionally: a trial quantity shipment may be arranged under an accelerated procedure, based on a simplified standalone agreement. Upon receipt, the client confirms that the product quality meets the required specifications.
  6. Pure Metals: drafts the contract and coordinates revisions with the client.
  7. Both parties: sign the final contract.
  8. Client: makes a partial advance payment — typically 25% of the total value of the initial product batch.
  9. Pure Metals: dispatches the goods and provides the transport documentation to the client.
  10. Client: completes final payment and receives the goods at the destination in accordance with the transport documentation and agreed delivery terms.
Can I visit your warehouse during the order process?2025-06-01T12:37:32+03:00

Absolutely. Once your RFQ or LOI is agreed upon and the FCO is signed, we’d be happy to arrange a visit to one of our warehouses that best suits your order specifics. If needed, we can also organize self-pickup of your order from the warehouse under the appropriate Incoterms 2020, making the process as smooth and convenient for you as possible.

Do you assist with paperwork troubleshooting (customs, compliance, etc.) if needed?2025-06-01T12:38:35+03:00

Yes, we assist with all necessary documentation to help streamline logistics, compliance, and customs clearance — regardless of the products combination or technical specifications in your order.

Do you provide lab certificates with each delivery?2025-06-01T12:39:41+03:00

Yes, every delivery includes a lab certificate to verify product purity and ensure batch-to-batch consistency.

Other Products

Ultra High-Purity Copper: Material Profile

Ultrafine high-purity copper powder is a specialized form of transition metal copper, engineered at micro and nanoscale levels to meet the most demanding performance requirements. As a transition element, copper possesses an incomplete d-electron shell, enabling it to exhibit multiple oxidation states — primarily Cu⁺ and Cu²⁺. The metal has a melting point of 1083 °C, a boiling point of 2600 °C, and a vapor pressure of 8.6 × 10⁻⁵ mm Hg at 1000 °C.

What sets ultrafine high-purity copper powder apart is its exceptionally high electrical resistivity (1.68 μΩ·cm) and outstanding thermal conductivity (0.941 cal/cm·°C·s), characteristics that are critical in high-end electronics, photonics, and precision manufacturing. The ultrafine particle structure, combined with a purity level of 5N (99.999%) or higher, makes this material ideal for applications where conductivity, heat transfer, and material integrity must not be compromised.

Performance of ultrafine high-purity copper powder is directly influenced by the presence of impurities. Even minimal traces of elements like oxygen, chromium, vanadium, manganese, titanium, zirconium, or niobium can significantly reduce the material’s conductive efficiency. This is why tight control of composition and oxygen content is essential during production, particularly for use in microelectronics, vacuum devices, energy systems, and other high-tech applications.

Product Form and Handling

Ultrafine high-purity copper powder is supplied as a finely dispersed metallic powder, typically featuring a controlled spherical or dendritic particle morphology and grain size in the micrometer or sub-micrometer range. Engineered for uniform dispersion, high surface area, and predictable sintering behavior, this form factor is ideal for advanced applications such as powder metallurgy, additive manufacturing, microelectronics, and catalysis.

Unlike solid copper forms, ultrafine high-purity copper powder requires careful handling and packaging. Each batch is sealed under inert conditions — typically in glass ampoules, vacuum-tight containers, or protective polymer-based packaging — to eliminate contamination risks and preserve purity during storage and international transit. This ensures the powder remains free from oxidation, moisture uptake, and particulate interference, maintaining its performance-critical characteristics across the entire supply chain.

Applications of Ultra High-Purity Copper (5N–6N)

Ultrafine high-purity copper powder — prized for its outstanding electrical conductivity, thermal efficiency, and chemical stability — plays a foundational role in modern high-performance industries. With a purity of 99.999% (5N) and above, it is engineered for applications where conventional-grade materials are insufficient. Key application areas include:

  • Aerospace and Aviation

    • Used in conductive pastes, EMI shielding, and ultralight thermal components for satellites, aircraft electronics, and propulsion systems operating under extreme thermal and radiation conditions.
  • Cryogenic and Quantum Technologies

    • Enables efficient thermal conduction in low-temperature systems, including cold heads, cryostats, and quantum processor mounts.
  • Chemical and Analytical Instrumentation

    • Serves as a highly inert, stable material for contact elements, electrodes, and housings in spectrometry, chromatography, and trace-element analysis tools.
  • Defense & Strategic Electronics

    • Integrated in radar assemblies, encrypted communication devices, and low-observable systems requiring ultra-stable electrical behavior in high-frequency ranges.
  • Medical & Biosensitive Systems

    • Supports the fabrication of biocompatible sensors, precision probes, and antimicrobial coatings.
  • Microelectronics and Nanofabrication

    • Forms high-density interconnects, conductive inks, and sintering pastes in IC packaging, 3D semiconductors, and MEMS devices.
  • Nuclear Energy & Science

    • Selected for use in ultra-low-background detectors, shielding components, and beamline structures due to its minimal radioactive impurity content.

  • Optical & Photonic Technologies

    • Applied in reflective layer systems, precision mounts, and waveguides within nanophotonic circuits and scientific optical instrumentation.
  • Renewable Power & Energy Storage

    • Incorporated into energy conversion and storage units, including lithium-ion batteries, photovoltaic cells, and power conductors for grid-level applications.
  • Vacuum Systems & High-Power Tubes

    • Ideal for fabricating electrodes, heat sinks, and contact interfaces in vacuum electronics and RF/microwave generator assemblies.
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